Magnesium (Mg) Sputtering Targets
Purity: 99.98%, Size: 4”, Thickness: 0.250”
Sputtering is a reliable and widely used technology for depositing thin films from numerous materials onto substrates of various shapes and sizes. The use of sputtering targets ensures a repeatable process that can be scaled from small research and development applications to medium- and large-scale production. Depending on the process parameters, chemical reactions may take place on the target surface, during material transport, or directly on the substrate. Although sputter deposition involves many variables, this complexity provides experts with significant control over film growth and microstructural properties.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, a method in which material is eroded from a “target” and deposited onto a substrate, such as a silicon wafer.
In semiconductor processes, sputter etching is applied when high etching anisotropy is required and selectivity is not a major concern.
Sputtering targets are also used for analytical purposes by progressively removing target material.
A common example is secondary ion mass spectroscopy (SIMS), where the sample is sputtered at a constant rate, and the ejected atoms are analyzed using mass spectrometry. This enables precise determination of the material’s composition and detection of extremely low impurity levels.
Sputtering also plays a role in space applications. It is one of the mechanisms involved in space weathering, which alters the physical and chemical characteristics of airless bodies such as asteroids and the Moon.
