Magnesium (Mg) Sputtering Targets
Purity: 99.98%, Size: 4”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process involving sputter targets is repeatable and can be scaled from small research and development projects to production batches requiring medium to large substrate areas. Chemical reactions may occur on the target surface, in flight, or on the substrate, depending on the process parameters. Although sputter deposition involves many variables that make the process complex, it provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. This deposition method involves eroding material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is preferred when a high degree of anisotropic etching is required and selectivity is not a major concern.
Sputter targets are also used for analytical purposes by etching away the target material. One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a controlled rate. As the target is sputtered, the concentration and identity of the emitted atoms are measured using mass spectrometry. With the aid of the sputtering target, the material composition can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
