Magnesium (Mg) Sputtering Targets
Purity: 99.95%, Size: 4”, Thickness: 0.250”
Sputtering is a well-established technique used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in flight, or on the substrate, depending on the process parameters. While the numerous parameters make sputter deposition complex, they also provide experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Deposition performed with sputter targets is a method of forming thin films by sputtering, which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of anisotropic etching is required and selectivity is not a priority.
Sputter targets are also used for analytical purposes by etching away the target material. One example is secondary ion mass spectroscopy (SIMS), in which the target sample is sputtered at a controlled rate. As the material is sputtered, the concentration and identity of emitted atoms are measured using mass spectrometry. Through the use of sputtering targets, the composition of the target material can be identified, and even extremely low impurity levels can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
