Magnesium (Mg) Sputtering Targets
Purity: 99.95%, Size: 4”, Thickness: 0.125”
Sputtering is a proven technique capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and scalable—from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions can occur on the target surface, in flight, or on the substrate, depending on the process parameters. Although many parameters make sputter deposition a complex process, they also provide experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition performed with sputter targets is a method of forming thin films by sputtering, which involves eroding material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is preferred when a high degree of anisotropic etching is required and selectivity is not a major concern.
Sputter targets are also used for analysis by etching away the target material. One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of the emitted atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
