Magnesium Fluoride (MgF₂) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.250”
Magnesium Fluoride (MgF₂) sputtering targets are widely used in thin-film deposition applications where high optical performance, durability, and uniformity are essential. Sputtering technology enables the controlled deposition of thin films onto substrates of varying shapes and sizes. The process is repeatable, scalable from laboratory research to full production, and adaptable for medium to large substrate areas. Depending on the chosen parameters, chemical interactions may occur on the target surface, during particle travel, or directly on the substrate, allowing experts precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used to deposit thin films by transferring material from a target onto a substrate such as a silicon wafer.
In semiconductor processing, sputter etching is applied when high anisotropy is required and selectivity is less critical.
Targets are also used for analytical purposes by removing surface layers.
A key example is secondary ion mass spectroscopy (SIMS), where the sample is sputtered at a constant rate, and the resulting ions are examined via mass spectrometry. This allows determination of material composition and detection of trace impurities.
Sputtering also plays a role in space environments. It contributes to space weathering, a process that alters the physical and chemical properties of airless celestial bodies such as the Moon and asteroids.
