Magnesium Fluoride (MgF₂) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes. The sputtering process is highly repeatable and can be scaled from small research projects to production batches involving medium to large substrate areas. Depending on the selected parameters, chemical reactions may occur on the target surface, during particle travel, or directly on the substrate. Although sputter deposition involves many variables, this complexity provides experts with a high level of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This technique deposits thin films by eroding material from a “target” onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target, particularly when high anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analytical purposes by gradually removing the target material.
One example is secondary ion mass spectroscopy (SIMS), in which the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of emitted atoms are measured using mass spectrometry. With the aid of sputtering targets, the composition of materials can be analyzed, allowing detection of even extremely low impurity levels.
Sputtering also has applications in space science. It is one of the mechanisms of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
