Magnesium Fluoride (MgF₂) Sputtering Targets
Purity: 99.9%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology for depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes. The sputtering process is repeatable and can be scaled from small research projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle travel, or directly on the substrate depending on process parameters. While sputter deposition is complex, it allows precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, where material is eroded from a “target” and deposited onto a substrate such as a silicon wafer.
Semiconductor sputtering targets are applied for etching, particularly when high anisotropy is required and selectivity is not critical.
Targets are also used for analytical purposes by removing material from the surface.
One key example is secondary ion mass spectroscopy (SIMS), in which the sample is sputtered at a constant rate. The concentration and identity of sputtered atoms are analyzed using mass spectrometry, enabling determination of material composition and detection of trace impurities.
Sputtering also has applications in space. It is a process involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
