Magnesium Fluoride (MgF₂) Sputtering Targets
Purity: 99.9%, Size: 1”, Thickness: 0.125”
Sputtering is a well-established technique for depositing thin films from a wide range of materials onto substrates of varying shapes and sizes. The sputtering process is highly repeatable and can be scaled from small research projects to medium- or large-scale production batches. Depending on process parameters, chemical reactions may occur on the target surface, during particle transit, or directly on the substrate. Although sputter deposition involves many variables, it allows precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are primarily used for thin-film deposition, where material is eroded from a “target” and deposited onto a “substrate” such as a silicon wafer.
In semiconductor processes, sputter etching is applied when high anisotropy is needed and selectivity is not a primary concern.
Sputter targets are also used for analytical applications, enabling the removal and study of target material.
One notable example is secondary ion mass spectroscopy (SIMS), in which the sample is sputtered at a constant rate and the ejected atoms are analyzed via mass spectrometry. This process allows determination of target composition and detection of extremely low impurity levels.
Sputtering is also relevant in space applications, as it contributes to space weathering—a process that alters the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
