Lithium Titanate (Li₂TiO₃) Sputtering Targets
Purity: 99.95%, Size: 3”, Thickness: 0.250”
Sputtering is a reliable technique used to deposit thin films from a wide range of materials onto substrates of varying shapes and sizes.
This process using sputter targets is highly repeatable and can be scaled from small research projects to full production environments.
Sputter target processes can be adapted for production batches involving medium to large substrate areas. Chemical reactions may occur
on the target surface, in-flight, or on the substrate, depending on process parameters. Although sputter deposition involves many
variables and is therefore complex, it provides experts with substantial control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin-film deposition by sputtering involves eroding material from a “target” and
transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is preferred when a high degree of anisotropic etching is
required and selectivity is not a critical factor.
Sputtering targets are also used for analytical purposes by etching away material from the target.
One example is secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs,
the concentration and identity of ejected atoms are measured using mass spectrometry. Through the use of sputtering, the composition
of the target material can be determined, allowing detection of extremely low impurity concentrations.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and
chemical properties of airless bodies such as asteroids and the Moon.
