Lithium Titanate (Li₂TiO₃) Sputtering Targets, Indium Bonded
Purity: 99.95%, Size: 3”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes. The process using sputter targets is highly repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in flight, or on the substrate. While sputter deposition involves many variables, this complexity provides experts with a high degree of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are widely used for thin film deposition. This method erodes material from a “target” and transports it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also employed for etching, particularly in applications requiring a high degree of etching anisotropy where selectivity is not a primary concern.
Sputtering targets are further used in analytical techniques involving the removal of material from a surface. A notable example is secondary ion mass spectrometry (SIMS), where the target is sputtered at a controlled rate while the emitted atoms are analyzed using mass spectrometry. With the help of the sputtering target, the composition of the material can be precisely determined, allowing detection of extremely low impurity concentrations.
Sputtering targets also play a role in space-related research. Sputtering is a form of space weathering—a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
