Lithium Titanate (Li₂TiO₃) Sputtering Targets, Indium Bonded
Purity: 99.95%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The process using sputter targets is highly repeatable and can be scaled from small research and development applications to production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in flight, or directly on the substrate. Although sputter deposition includes many variables, this complexity provides experts with excellent control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are commonly used for thin film deposition, a method that erodes material from a “target” and transfers it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications where a high degree of anisotropy is required and selectivity is less critical.
Additionally, sputtering targets are employed in analytical processes that involve etching material away from the surface. A key example is secondary ion mass spectrometry (SIMS), where the sample is sputtered at a steady rate, and the emitted atoms are analyzed by mass spectrometry. This enables highly precise determination of material composition and detection of extremely low impurity concentrations.
Sputtering also plays an important role in space-related processes. It is one of the mechanisms of space weathering—a phenomenon that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
