Lithium Niobate (LiNbO3) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process involving sputter targets is repeatable and can be scaled from small research and development projects to larger production batches.
This method can be adapted for medium to large substrate areas. Chemical reactions may occur on the target surface, during particle flight,
or directly on the substrate, depending on the process parameters. Although sputter deposition is complex due to the many variables involved,
it provides experts with significant control over film growth and microstructure.Applications of Sputtering Targets
Sputtering targets are used for film deposition. The deposition created by sputter targets involves eroding material from a “target” source
and transferring it onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target, particularly in situations requiring a high degree of etching anisotropy
where selectivity is not a primary concern.
Sputter targets are also used for analytical purposes by etching away the target material.
An example of this occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the material
is sputtered, the concentration and identity of the released atoms are measured using mass spectrometry. Through the use of sputtering
targets, the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and
chemical properties of airless bodies such as the Moon and asteroids.
