Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets
| Property | Specification |
|---|---|
| Purity | 99.9% |
| Size | 6” |
| Thickness | 0.250” |
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process using sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter targets can also be adapted to production batches involving medium to large substrate areas. The chemical reaction may occur on the target surface, in-flight, or on the substrate depending on the process parameters. Although sputter deposition involves many variables, it enables experts to maintain a high degree of control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. The deposition achieved by sputter targets is a method of forming thin films through sputtering, which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not a concern.
Sputter targets are also used for analysis by gradually etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the sample is sputtered, the concentration and identity of released atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the target material can be identified, and extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms involved in space weathering, a process that modifies the physical and chemical properties of airless bodies, such as asteroids and the Moon.
