Lead (Pb) Sputtering Targets
Purity: 99.99+%, Size: 1”, Thickness: 0.125”
Technical Properties:
| Property | Value |
|---|---|
| Purity | 99.99+% |
| Size | 1” |
| Thickness | 0.125” |
Description:
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto various substrate shapes and sizes. The process with sputter targets is repeatable and scalable, suitable for small research and development projects as well as medium to large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters. Although sputter deposition involves many variables, it provides experts with precise control over film growth and microstructure.
Applications:
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Film Deposition: Sputtering targets are used to deposit thin films by eroding material from a target onto a substrate, such as a silicon wafer.
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Semiconductor Etching: Sputter targets are applied for etching when a high degree of anisotropy is needed and selectivity is not critical.
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Analytical Techniques: Used in analysis, such as secondary ion mass spectrometry (SIMS), where the target is sputtered at a constant rate and the concentration and identity of sputtered atoms are measured. This allows determination of target composition and detection of even trace impurities.
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Space Applications: Sputtering is a form of space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
