Iron Oxide (Fe₃O₄) Sputtering Target
Specifications:
| Property |
Value |
| Purity |
99.9% |
| Size |
3” |
| Thickness |
0.125” |
Description:
Sputtering technology allows deposition of thin films from diverse materials onto a variety of substrates. The process with Fe₃O₄ sputtering targets is repeatable, scalable from R&D to production, and allows precise control over film growth and microstructure. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters.
Applications:
| Application Area |
Description |
| Film Deposition |
Thin films are deposited by eroding material from a target onto substrates such as silicon wafers. |
| Semiconductor Etching |
Provides high etching anisotropy when selectivity is not critical. |
| Analytical Techniques (SIMS) |
Enables determination of composition and trace impurities by sputtering at a constant rate and mass spectrometry analysis. |
| Space Applications |
Contributes to space weathering, altering physical and chemical properties of airless bodies such as asteroids and the Moon. |
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Download ……………………….. MSDS
