Iron (Fe) Sputtering Targets
Purity: 99.99%, Size: 2”, Thickness: 0.250”
Sputtering is a well-established technology for depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The process using sputter targets is highly repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, during particle transit, or on the substrate itself. Although sputter deposition involves multiple parameters, this complexity provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. The deposition process involves eroding material from a “target” source and depositing it onto a “substrate,” such as a silicon wafer.
In semiconductor processing, sputtering targets are also used for etching. Sputter etching is applied when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are further used for analytical purposes, such as in secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. During this process, the concentration and identity of sputtered atoms are measured using mass spectrometry, allowing determination of target composition and detection of even extremely low impurity levels.
Sputtering targets also have applications in space science. Sputtering is a key mechanism of space weathering, which alters the physical and chemical properties of airless celestial bodies, including asteroids and the Moon.
