Iron (Fe) Sputtering Targets
Purity: 99.99%, Size: 2”, Thickness: 0.125”
Sputtering is a well-established and highly controlled technique used to deposit thin films from many types of materials onto substrates of varying shapes and sizes. The sputtering process is repeatable, scalable, and suitable for both small research applications and large-scale production environments. Depending on the selected process parameters, chemical reactions can occur on the target surface, during particle travel, or directly on the substrate. Although sputter deposition involves many interdependent variables, this complexity provides specialists with exceptional control over film growth, microstructure, and material properties.
Applications of Sputtering Targets
Sputtering targets are widely used for thin-film deposition. In this process, material is physically eroded from the “target” and deposited onto a “substrate,” such as a silicon wafer.
In semiconductor applications, targets are also used for sputter etching—a technique selected when high etching anisotropy is required and material selectivity is less critical.
Sputtering plays an important role in analytical methods as well.
In Secondary Ion Mass Spectroscopy (SIMS), for example, the sample is sputtered at a controlled rate while the ejected atoms are analyzed using mass spectrometry. This enables precise determination of material composition and detection of extremely low impurity concentrations.
Sputtering targets also have relevance in planetary science. Sputtering is a natural space-weathering mechanism that modifies the physical and chemical properties of airless bodies such as asteroids and the Moon.
