Iron (Fe) Sputtering Targets
Purity: 99.95%, Size: 2”, Thickness: 0.250”
Sputtering is a proven and widely used technology for depositing thin films onto a diverse range of substrate shapes and sizes. The process is highly repeatable and can be scaled from small research and development applications to full production environments. Sputtering conditions can be tailored for medium to large substrate areas, and depending on the process parameters, chemical reactions may occur on the target surface, during particle travel, or directly on the substrate. Although sputtering involves many variables, this complexity enables experts to maintain precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are commonly used for thin-film deposition. In this method, material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
In semiconductor processing, sputter targets are also used for sputter etching, a technique suitable when high etching anisotropy is required and selectivity is less critical.
Sputtering plays an important role in analytical techniques as well.
For example, in Secondary Ion Mass Spectroscopy (SIMS), the target material is sputtered at a constant rate, and the identity and concentration of the sputtered atoms are measured using mass spectrometry. This allows highly precise determination of material composition, including detection of extremely low impurity levels.
Sputtering also has notable applications in planetary science. It is one of the primary mechanisms of space weathering, altering the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
