Iron (Fe) Sputtering Targets
Purity: 99.95%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of different shapes and sizes.
The process using sputter targets is highly repeatable and can be scaled from small research and development applications to medium- and
large-scale production batches. Depending on the process parameters, chemical reactions may occur on the target surface, during particle flight,
or directly on the substrate. Although sputter deposition involves many variables, this complexity provides experts with extensive control over
the film’s growth, structure, and final properties.
Applications of Sputtering Targets
Sputtering targets are widely used for thin-film deposition. The process involves eroding material from a “target” and transferring it onto a
“substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for sputter etching, which is preferred when a high degree of etching anisotropy is required and
selectivity is not a critical factor.
In analytical techniques, sputtering targets play an important role by enabling controlled material removal.
For example, in Secondary Ion Mass Spectroscopy (SIMS), the sample is sputtered at a constant rate while the identity and concentration of
ejected atoms are measured using mass spectrometry. This allows precise analysis of material composition, including detection of extremely
low impurity levels.
Sputtering targets also have relevance in space-related applications. Sputtering is one of the mechanisms involved in space weathering—a
process that alters the physical and chemical properties of airless bodies such as the Moon and asteroids.
