Iron (Fe) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto various substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter
targets can also be adapted for production batches involving medium to large substrate areas. Depending on the process parameters, chemical
reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables and can be
complex, it offers experts significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering,
which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is preferred when a high degree of etching anisotropy is required
and selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered,
the concentration and identity of sputtered atoms are measured using mass spectrometry. With the support of the sputtering target, the
composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the forms of space weathering, a process that alters the physical and
chemical properties of airless bodies, such as asteroids and the Moon.
