Iron (Fe) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.250”
Sputtering is a well-established thin-film deposition technique capable of applying materials onto substrates of many shapes and sizes. The process is highly repeatable and can be scaled from small research applications to full production environments. Sputtering conditions can be adjusted to suit medium or large substrate areas, and depending on the parameters, chemical reactions may occur on the target surface, during particle travel, or on the substrate itself. Although sputter deposition involves numerous variables, this complexity provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are widely used for thin-film deposition, where material is removed from the “target” and deposited onto a “substrate,” such as a silicon wafer.
In semiconductor processes, sputtering targets are also used for sputter etching—a technique selected when strong etching anisotropy is required and selectivity is less critical.
Sputtering additionally supports analytical techniques.
In Secondary Ion Mass Spectroscopy (SIMS), for example, the sample is sputtered at a controlled rate while the ejected atoms are analyzed using mass spectrometry. This allows detailed determination of material composition and the detection of extremely low impurity concentrations.
Sputtering targets also play a role in planetary science. Sputtering is a natural form of space weathering, influencing the physical and chemical properties of airless bodies such as asteroids and the Moon.
