Indium Zinc Oxide/IZO (InZnO) Sputtering Targets
Purity: 99.99%, Size: 4”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process involving sputter targets is consistent and can be scaled from small research and development projects to medium and large production batches.
Chemical reactions may occur on the target surface, during particle flight, or on the substrate, depending on the process parameters.
Although sputter deposition involves many variables, this complexity allows experts to maintain extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, a technique in which material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are employed for etching when a high degree of anisotropy is required and selectivity is less critical.
Sputter targets are also used in analytical applications by gradually removing material from the target surface.
One example is secondary ion spectroscopy (SIMS), where the sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of emitted atoms are measured using mass spectrometry. Through this process, the composition of the material can be accurately determined, including detecting extremely low impurity levels.
Sputtering targets also have applications in space. Sputtering is one form of space weathering—a process that alters the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
