Indium (In) Sputtering Targets
Purity: 99.999%, Size: 1”, Thickness: 0.125”
Sputtering is a reliable and widely used technology for depositing thin films from various materials onto substrates of different shapes and sizes. The process using sputter targets is consistent, repeatable, and easily scalable from small research and development projects to medium- and large-scale production environments. Depending on the process parameters, chemical reactions may occur on the target surface, during material transport, or directly on the substrate. While sputter deposition involves many variables and is therefore complex, it provides experts with a high degree of control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. This method involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications, particularly when a high degree of anisotropy is required and selectivity is not a primary concern.
Sputter targets are further utilized for analytical purposes by removing material from the target surface. One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of ejected atoms are measured through mass spectrometry. This allows determination of the material’s composition and detection of extremely low impurity levels.
Sputtering targets also have applications in space-related environments. Sputtering is one of the mechanisms of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
