Indium (In) Sputtering Targets
Purity: 99.99%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of different shapes and sizes. The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables and is therefore complex, it provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition performed with sputter targets involves eroding material from a “target” onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target, particularly in cases where a high degree of etching anisotropy is required and selectivity is not a major concern.
Sputter targets are also used for analytical purposes by removing material from the target surface. One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering proceeds, the concentration and identity of ejected atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be determined and even extremely low levels of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
