Germanium (Ge) Sputtering Targets
Purity: 99.999%, Size: 2”, Thickness: 0.125”
Sputtering is a reliable technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is consistent and scalable—from small research and development projects to medium and large production batches.
Chemical reactions may occur on the target surface, during particle flight, or on the substrate, depending on the specific process parameters.
Although sputter deposition involves many variables, this complexity provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition. This method involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of anisotropy is required and selectivity is not critical.
Sputter targets are also employed for analytical purposes by gradually removing material from the target surface.
One example is secondary ion mass spectroscopy (SIMS), where the sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of the emitted atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be analyzed, and even extremely low impurity levels can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering—a process that alters the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
