Copper (Cu) Sputtering Targets
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.999% |
| Size | 6” |
| Thickness | 0.250” |
| Process Overview | Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process with sputter targets is repeatable and can be scaled up from small research and development projects. Targets can be adapted to production batches involving medium to large substrate areas. The chemical reaction can occur on the target surface, in-flight, or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the area. |
| Applications of Sputtering Targets | Sputtering targets are used for film deposition. This involves eroding material from a “target” source onto a “substrate” such as a silicon wafer. Semiconductor sputtering targets are used to etch the target when high etching anisotropy is required and selectivity is not a concern. Sputter targets are also used for analysis by etching away the target material. One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate, and the concentration and identity of sputtered atoms are measured using mass spectrometry. This allows determination of target composition and detection of extremely low concentrations of impurities. Sputtering targets also have applications in space, as a form of space weathering that alters the physical and chemical properties of airless bodies like asteroids and the Moon. |
