Copper (Cu) Sputtering Targets (2” × 0.250”, 99.999% purity)
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.999% |
| Size | 2” |
| Thickness | 0.250” |
| Process Overview | Sputtering deposits thin films from diverse materials onto various substrate shapes. The process is repeatable, scalable from small R&D to medium/large production batches, and allows chemical reactions on the target surface, in-flight, or on the substrate. Multiple parameters provide precise control over film growth and microstructure. |
| Applications | – Thin film deposition on substrates like silicon wafers. – Semiconductor etching requiring high anisotropy. – Analytical applications, e.g., SIMS for measuring composition and detecting low-concentration impurities. – Space applications: space weathering alters physical and chemical properties of airless bodies such as asteroids and the Moon. |
