Copper (Cu) Sputtering Targets (2” × 0.125”, 99.999% purity).
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.999% |
| Size | 2” |
| Thickness | 0.125” |
| Process Overview | Sputtering deposits thin films from various materials onto diverse substrate shapes. The process is repeatable and scalable from small R&D to medium/large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate. Multiple parameters allow precise control over film growth and microstructure. |
| Applications | – Thin film deposition on substrates like silicon wafers. – Semiconductor etching where high anisotropy is needed. – Analytical applications such as SIMS for determining composition and detecting low-concentration impurities. – Space applications: space weathering alters physical and chemical properties of airless bodies like asteroids and the Moon. |
