Copper (Cu) Sputtering Targets (1”, 0.250”, 99.999% purity):
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.999% |
| Size | 1” |
| Thickness | 0.250” |
| Process Overview | Sputtering deposits thin films onto diverse substrate shapes and sizes. The process is repeatable, scalable from R&D to medium/large production batches, and can involve chemical reactions on the target surface, in-flight, or on the substrate. Numerous adjustable parameters give experts detailed control over film growth and microstructure. |
| Applications | • Thin Film Deposition: Material is eroded from the target and deposited on substrates like silicon wafers. • Semiconductor Etching: Used when high anisotropy is needed, regardless of selectivity. • Analytical Sputtering: In SIMS, sputtering at a constant rate allows measurement of composition and trace impurities using mass spectrometry. • Space Applications: Sputtering contributes to space weathering, altering the physical and chemical properties of airless bodies such as asteroids and the Moon. |
