Copper (Cu) Sputtering Targets
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.99% |
| Size | 4” |
| Thickness | 0.250” |
| Process Overview | Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process with sputter targets is repeatable and can be scaled from small R&D projects. Targets can be adapted to production batches involving medium to large substrate areas. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters. The many parameters make sputter deposition complex but allow precise control over growth and microstructure. |
| Applications of Sputtering Targets | Used for film deposition by eroding material from a “target” onto a “substrate” like a silicon wafer. Also used for semiconductor etching when high anisotropy is required, and for analysis via SIMS, where sputtered atoms are measured to determine composition and detect trace impurities. Applied in space weathering, affecting physical and chemical properties of airless bodies such as asteroids and the Moon. |
