Copper (Cu) Sputtering Target – Specifications & Applications
| Category | Details |
|---|---|
| Material | Copper (Cu) |
| Purity | 99.99% |
| Size | 1” |
| Thickness | 0.250” |
| Description | Sputtering is a proven technique used to deposit thin films across various substrate shapes and sizes. The process is highly repeatable, scalable from R&D to medium- and large-scale production, and allows extensive control over film growth and microstructure. Chemical reactions may occur on the target surface, during flight, or on the substrate depending on process parameters. |
| Applications | • Thin Film Deposition: Material is eroded from the target and deposited onto substrates such as silicon wafers. • Semiconductor Sputtering: Used for sputter etching where high anisotropy is required and selectivity is less critical. • Analytical Etching: In SIMS, continuous sputtering enables detection of composition and trace impurities via mass spectrometry. • Space Science: Sputtering contributes to space weathering, altering the chemical and physical properties of airless bodies such as the Moon and asteroids. |
