Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$605.31

Cobalt Iron Boron (Co-Fe-B) Sputtering Target — Product Specifications

Property Details
Material Cobalt Iron Boron (Co-Fe-B) Alloy
Purity 99.95%
Size 3”
Thickness 0.125”
Description Sputtering is a proven thin-film deposition technology for diverse substrates. Process is repeatable, scalable, and allows precise control over growth and microstructure. Reactions may occur on the target surface, in-flight, or on the substrate.

Applications of Sputtering Targets
Application Area Explanation
Film Deposition Material from the target is eroded and deposited onto a substrate, e.g., silicon wafers.
Semiconductor Etching Sputter etching used where high anisotropy is required, selectivity is secondary.
Analytical Techniques (SIMS) Enables analysis of material composition and trace impurity detection by measuring sputtered atoms.
Space Science Contributes to space weathering, altering physical and chemical properties of airless bodies like asteroids and the Moon.

Alloy-Specific Applications (Co-Fe-B)
Property / Requirement Explanation
Mechanical Hardness & Wear Resistance Boron alloys with Co-Fe provide high hardness, excellent wear, and corrosion resistance, ideal for coatings.
Electrical Conductivity Excellent conductivity and resistance to attack by molten metals.
High Tensile Strength & Thermal Stability Suitable for high-stress and high-temperature applications like metal ribbons for razor blades and tire cords.
Soft Magnetic Properties Amorphous Co-Fe-B alloys combine high mechanical hardness with soft magnetic characteristics, ideal for transformer cores and toroids.
Coating Applications Surface enhancement for metals and ceramics, improving industrial and electronic performance.
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Download ……………………….. MSDS

Size: 1 piece

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