Cobalt Iron Boron (Co-Fe-B) Sputtering Target — Specifications
| Property | Details |
|---|---|
| Material | Cobalt Iron Boron (Co-Fe-B) Alloy |
| Purity | 99.9% |
| Size | 3” |
| Thickness | 0.125” |
| Description | Sputtering technology for thin-film deposition on diverse substrates. Process is repeatable, scalable, and allows precise control over growth and microstructure. Reactions may occur on the target surface, in-flight, or on the substrate. |
Applications of Sputtering Targets
| Application Area | Explanation |
|---|---|
| Film Deposition | Target material is eroded and deposited onto substrates such as silicon wafers. |
| Semiconductor Etching | Sputter etching provides high anisotropy where selectivity is secondary. |
| Analytical Techniques (SIMS) | Enables analysis of material composition and trace impurities by measuring sputtered atoms. |
| Space Science | Contributes to space weathering, altering physical and chemical properties of airless bodies like asteroids and the Moon. |
Alloy-Specific Applications (Co-Fe-B)
| Property / Requirement | Explanation |
|---|---|
| Mechanical Hardness & Wear Resistance | High hardness, excellent wear, and corrosion resistance; ideal for coatings. |
| Electrical Conductivity | Excellent conductivity; resistant to attack by molten metals. |
| High Tensile Strength & Thermal Stability | Suitable for high-stress and high-temperature applications such as metal ribbons for razor blades and tire cords. |
| Coating Applications | Enhances surface properties of metals and ceramics, improving industrial performance. |
