Boron Nitride (BN) Sputtering Target – Product Details
| Parameter | Details |
|---|---|
| Product Name | Boron Nitride (BN) Sputtering Target |
| Purity | 99.5% |
| Size | 3” diameter |
| Thickness | 0.250” |
| Material Characteristics | Heat- and chemically-resistant refractory compound, available in hexagonal (h-BN) and cubic (c-BN) crystalline forms, stable under sputtering conditions |
| Film Characteristics | Enables uniform thin film deposition, controllable microstructure, high reproducibility, suitable for protective, optical, and insulating coatings |
Applications of Boron Nitride Sputtering Targets
| Application Area | Description |
|---|---|
| Thin Film Deposition | Deposits thin films onto substrates such as silicon wafers or glass |
| Semiconductor Etching | Used in sputter etching where high anisotropy is required and selectivity is not critical |
| Analytical Techniques (SIMS) | Enables elemental analysis and precise measurement of low-concentration impurities |
| Space Applications | Models sputtering effects in space weathering, affecting asteroids, the Moon, and other airless bodies |
| Cutting Tool Coatings | c-BN coatings provide high hardness, chemical inertness, thermal stability, and wear resistance for cutting applications |
| Protective & Functional Coatings | Suitable for optical coatings, electrical insulating layers, and high-temperature protective layers |
| Lubrication & High-Temperature Processes | h-BN acts as a soft, low-friction, thermally conductive, and electrically insulating material in metal forming and high-temperature processes |
Key Material Notes
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Hexagonal BN (h-BN): soft, lubricating, thermally conductive, electrically insulating.
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Cubic BN (c-BN): extremely hard, chemically stable, high wear resistance, suitable for cutting tools and protective coatings.
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Sputtering enables precise thin or thick film deposition, even on complex geometries, with lower coating temperatures compared to other methods.
