Boron Nitride (BN) Sputtering Targets
Purity: 99.5%, Size: 2”, Thickness: 0.250”
Sputtering is a proven technique capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes.
The process using sputter targets is highly repeatable and can be scaled from small research and development projects to medium- and large-scale production batches. The process parameters determine whether chemical reactions occur on the target surface, in-flight, or on the substrate. These numerous parameters make sputter deposition a complex process but also allow experts a high degree of control over the growth and microstructure of the deposited area.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. This method deposits thin films by sputtering, which erodes material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching the target. Sputter etching is preferred when a high degree of etching anisotropy is required and selectivity is not a concern.
Sputter targets are also used for analysis by etching away target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target erodes, the concentration and identity of sputtered atoms are measured using mass spectrometry. Through the use of the sputtering target, the composition of the target material can be determined, and extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
Material Overview
Boron nitride is a heat- and chemically-resistant refractory compound of boron and nitrogen with the chemical formula BN. It exists in several crystalline forms that are isoelectronic with similarly structured carbon lattices. The hexagonal form, corresponding to graphite, is the most stable and soft among BN polymorphs, making it suitable as a lubricant and an additive in cosmetic products. The cubic structure, analogous to diamond, is known as c-BN; it is softer than diamond but offers superior thermal and chemical stability. Due to its excellent stability, boron nitride ceramics are traditionally used in high-temperature equipment components.
Cubic boron nitride (c-BN) has been widely used as a coating material for cutting tools due to its outstanding mechanical and chemical properties. Key characteristics of boron nitride include high hardness, low friction coefficient, good thermal conductivity, high electrical resistivity, high wear resistance, and chemical inertness at elevated temperatures. It is the hardest material after diamond and is superior to diamond in chemical stability against oxygen and ferrous materials at high temperatures.
Polymorphs in Coatings
Boron nitride commonly appears in two polymorphs in coatings: hexagonal boron nitride (h-BN) and cubic boron nitride (c-BN). Hexagonal boron nitride is known for its softness, low friction coefficient, lubricating properties at both low and high temperatures, electrical insulation, and thermal conductivity. It is widely used as a solid lubricant in metal-forming dies and high-temperature forming processes in various environments.
In contrast, the cubic phase exhibits high hardness and the extreme properties mentioned above, making c-BN a preferred coating material for cutting tools. Its use in applications such as dry cutting, high-speed machining, and the cutting of hard materials has increased significantly in recent years. Sintered c-BN cutting tools are already widely used in the market; however, they have drawbacks such as high cost, limited ductility, and difficulty in forming into various shapes.
As a result, demand for thin or thick BN film deposition—whether for cutting purposes, protective coatings, optical layers, or electrical insulation—has grown rapidly. Many researchers are working to synthesize cubic-phase boron nitride coatings. Among the available coating methods, the sputtering technique—a physical vapor deposition (PVD) process—stands out due to its lower deposition temperature, ability to produce thinner coatings, and suitability for sharp edges and complex geometries.
