Boron Carbide (B4C) Sputtering Targets, indium
Purity: 99.5%, Size: 1”, Thickness: 0.125”
Sputtering is a reliable technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes. The process using sputter targets is consistent and can be scaled from small research and development projects to larger production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during material transport, or on the substrate depending on process conditions. Although sputter deposition involves numerous variables, it provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition. This method transfers material from a “target” onto a “substrate,” such as a silicon wafer. Semiconductor sputtering targets are used for etching in situations requiring high anisotropy even when selectivity is not essential. Sputter targets are also used in analytical processes that require removing layers of material from the target.
One example is secondary ion mass spectroscopy (SIMS), where the target material is sputtered at a constant rate. During sputtering, the composition and identity of ejected atoms are measured using mass spectrometry. Through this process, the material’s composition can be determined, and extremely low levels of impurities can be detected.
Sputtering targets are also relevant in space-related phenomena. Sputtering is one mechanism of space weathering, which alters the physical and chemical characteristics of airless celestial bodies such as the Moon and asteroids.
Boron Nitride Overview
Boron nitride is a heat-resistant and chemically stable refractory compound composed of boron and nitrogen, with the chemical formula BN. It appears in several crystalline forms that are isoelectronic with carbon-based structures. The hexagonal form, analogous to graphite, is the most stable and softest BN polymorph and is widely used as a lubricant and as an additive in cosmetic formulations. The cubic form, comparable to diamond, is known as c-BN; although slightly softer than diamond, it demonstrates superior thermal and chemical stability. Because of these characteristics, boron nitride ceramics are traditionally used in high-temperature applications.
Properties and Performance
Cubic boron nitride (c-BN) has become a key coating material for cutting tools due to its strong mechanical and chemical performance. Notable properties of boron nitride include high hardness, low friction coefficient, good thermal conductivity, high electrical resistivity, strong wear resistance, and chemical inertness at elevated temperatures. Boron nitride is the second hardest material after diamond and exceeds diamond in chemical stability against oxygen and ferrous materials at high temperatures.
Polymorphs and Coating Applications
Boron nitride coatings typically utilize two polymorphs: hexagonal boron nitride (h-BN) and cubic boron nitride (c-BN). Hexagonal boron nitride is soft, has a low friction coefficient, and functions as a lubricant at both low and high temperatures. It is electrically insulating, thermally conductive, and commonly used as a solid lubricant in metal-forming dies and high-temperature forming processes.
Cubic boron nitride, on the other hand, provides exceptional hardness and other superior properties, making it suitable for cutting tool coatings. Its use has increased in applications such as dry cutting, high-speed machining, and processing hard materials. Although sintered c-BN cutting tools are available, they can be costly, have limited ductility, and are challenging to shape.
