Boron Carbide (B4C) Sputtering Targets
Purity: 99.5% Size: 3” Thickness: 0.250”
Sputtering is a reliable technique for depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process using sputter targets is highly repeatable and scalable, suitable for both small research projects and larger production batches with medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters. Despite its complexity, sputter deposition offers precise control over film growth and microstructure.
Applications of Sputtering Targets
-
Thin Film Deposition: Material is eroded from a “target” and deposited onto a substrate, such as silicon wafers.
-
Semiconductor Etching: Sputter etching is applied where high anisotropy is required, and selectivity is not critical.
-
Analytical Techniques: In methods like secondary ion spectroscopy (SIMS), sputtered atoms are analyzed via mass spectrometry to determine composition and detect trace impurities.
-
Space Applications: Sputtering occurs naturally as space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
Boron Nitride Overview
Boron nitride (BN) is a heat- and chemically-resistant compound of boron and nitrogen. It exists in several crystalline forms isoelectronic with carbon lattices:
-
Hexagonal BN (h-BN): Soft, stable, lubricating, electrically insulating, and thermally conductive. Widely used in high-temperature metal forming dies and processes, as well as in cosmetic products.
-
Cubic BN (c-BN): Analogous to diamond—softer than diamond but with superior thermal and chemical stability. Commonly used in high-temperature equipment and cutting tool coatings.
Properties and Coating Applications
Cubic boron nitride (c-BN) is valued for:
-
High hardness
-
Low friction coefficient
-
Excellent thermal conductivity
-
High electrical resistivity
-
Superior wear resistance
-
Chemical inertness at high temperatures
It is the hardest material after diamond and surpasses diamond in chemical stability against oxygen and ferrous metals at high temperatures.
Polymorphs and Usage:
-
h-BN: Soft, lubricating, thermally conductive; used in solid lubricants and metal forming.
-
c-BN: Hard, chemically inert, ideal for cutting tools; applied in dry cutting, high-speed machining, and hard material processing.
Sintered c-BN tools are widely used but have limitations like high cost, poor ductility, and difficulty forming complex shapes.











