Boron Carbide (B4C) Sputtering Targets, indium
Purity: 99.5%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on the process parameters. While sputter deposition involves many variables, it allows experts extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. This method deposits thin films by eroding material from a “target” source onto a “substrate,” such as a silicon wafer. Semiconductor sputtering targets are used for etching when a high degree of etching anisotropy is required and selectivity is not critical. Sputter targets are also applied in analytical techniques by etching away the target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of ejected atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the material can be determined, and even extremely low levels of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
Boron Nitride Overview
Boron nitride is a heat- and chemically-resistant refractory compound of boron and nitrogen with the chemical formula BN. It exists in several crystalline forms that are isoelectronic with similarly structured carbon lattices. The hexagonal form, corresponding to graphite, is the most stable and softest among BN polymorphs and is widely used as a lubricant and an additive in cosmetic products. The cubic form, analogous to diamond, is called c-BN; while it is softer than diamond, it offers superior thermal and chemical stability. Due to these advantages, boron nitride ceramics are traditionally used in high-temperature equipment.
Properties and Performance
Cubic boron nitride (c-BN) has become a major coating material for cutting tools because of its excellent mechanical and chemical properties. Important properties of boron nitride include high hardness, low friction coefficient, good thermal conductivity, high electrical resistivity, high wear resistance, and chemical inertness at elevated temperatures. Boron nitride is the hardest material after diamond. Additionally, it surpasses diamond in chemical stability against oxygen and ferrous materials at high temperatures.
Polymorphs and Coating Applications
Boron nitride coatings commonly feature two polymorphs: hexagonal boron nitride (h-BN) and cubic boron nitride (c-BN). Hexagonal boron nitride is known for being soft, having a low friction coefficient, and functioning as a lubricant at both low and high temperatures. It is electrically insulating, thermally conductive, and widely used as a solid lubricant in metal-forming dies and high-temperature metal-forming processes.
In contrast, cubic boron nitride offers high hardness and other exceptional properties, making it ideal for cutting tool coatings. Its use has increased for applications such as dry cutting, high-speed machining, and cutting hard materials. Although sintered c-BN cutting tools are widely available, they have drawbacks such as high cost, poor ductility, and difficulty being formed into various shapes.
As a result, demand for thin or thick BN films—for cutting applications, protective coatings, optical layers, and electrical insulation—has grown significantly. Among different coating techniques, sputtering—a physical vapor deposition (PVD) method—stands out due to its lower coating temperatures, ability to produce thin films, and capability to coat sharp edges and complex geometries.
