Boron (B) Sputtering Targets
Purity: 99.9%, Size: 3”, Thickness: 0.125”
Product Details
| Parameter | Description |
|---|---|
| Material | Boron (B) |
| Purity | 99.9% |
| Size | 3” |
| Thickness | 0.125” |
| Form | Sputtering Target |
| Manufacturer | Nano Chicago |
| Key Features | Enables precise thin film deposition, repeatable and scalable process, adaptable for medium to large substrate areas |
Description
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. Using sputter targets, the process is repeatable and scalable, from small research projects to production batches involving medium to large substrate areas. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters. While sputter deposition involves complex parameters, it provides experts with a high degree of control over film growth and microstructure.
Boron is widely used in ion implantation and thin film applications. Boron ions are applied for ion-beam doping of semiconductors, surface modification by ion implantation, synthesizing boron-containing films and coatings such as boron nitride, and trench filling in particle detectors. Boron-based coatings enhance surface properties, providing high hardness, toughness, corrosion resistance, wear resistance, and in extreme cases, diamond-like properties. Sputtering boron is highly relevant for these applications, particularly using conventional planar magnetron systems.
The most common method to produce boron-containing coatings with a planar magnetron is using a boron-containing compound target, where the non-boron component helps directly obtain the desired boron film or provides necessary electrical conductivity. Pure boron magnetron targets are primarily used in semiconductor doping and reactive magnetron sputtering to deposit boron nitride films in a nitrogen atmosphere.
Applications
Carbon nanotubes doped with metallic nanopowders provide significant enhancements in both electrical and mechanical performance. These improvements include increased hardness, tensile strength, specific strength, and elastic modulus. As a result, these materials are widely utilized across various fields. Some of these applications include: 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates.
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Film deposition: Depositing thin films by sputtering involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
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Semiconductor etching: Sputter etching is chosen where high etching anisotropy is needed and selectivity is not a concern.
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Material analysis: For example, in secondary ion mass spectroscopy (SIMS), the target sample is sputtered at a constant rate while the concentration and identity of sputtered atoms are measured.
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Space applications: Sputtering contributes to space weathering, changing physical and chemical properties of airless bodies like asteroids and the Moon.
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Ion implantation and coatings: Boron ions are used for ion-beam doping, surface modification, synthesizing boron-containing films, trench filling, and creating high-hardness, corrosion-resistant, and wear-resistant coatings.
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Magnetron sputtering: Boron and boron-compound targets are used in planar magnetron systems for semiconductor doping and reactive sputtering to deposit boron nitride films.
