Boron (B) Sputtering Targets – Indium
Purity: 99.9% Size: 2” Thickness: 0.125”
Sputtering is a versatile and proven method for depositing thin films from a wide variety of materials onto substrates of different shapes and sizes. The process using sputter targets is reproducible and can scale from small R&D projects to medium and large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate, depending on the process parameters. While the process involves multiple variables, experts gain precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin Film Deposition: Material is transferred from the target onto substrates, such as silicon wafers.
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Semiconductor Etching: Sputter etching is used when high anisotropy is needed and selectivity is not critical.
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Analytical Techniques: Secondary ion mass spectrometry (SIMS) uses sputtering to measure target composition and detect trace impurities.
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Space Applications: Sputtering occurs in space weathering, altering the properties of airless bodies like asteroids and the Moon.
Boron in Coatings and Thin Films
Boron is widely applied in ion implantation and thin film technologies, including:
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Ion-beam doping of semiconductors
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Surface modification via ion implantation
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Synthesis of boron-containing films and coatings (e.g., boron nitride)
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Trench filling in particle detectors
Boron-based coatings enhance material surfaces with high hardness, toughness, corrosion resistance, wear resistance, and in some cases, diamond-like performance.
Magnetron Sputtering of Boron:
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Boron-containing coatings are commonly produced using planar magnetron targets, sometimes incorporating non-boron elements to achieve desired film properties or electrical conductivity.
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Pure boron targets are frequently used for semiconductor doping and reactive magnetron sputtering of boron nitride films in a nitrogen atmosphere.
