Bismuth Oxide (Bi₂O₃) Sputtering Targets, Indium
Purity: 99.9% Size: 3” Thickness: 0.125”
Sputtering is a reliable technique for depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The process is highly repeatable and scalable, suitable for both research and medium-to-large production batches. Depending on process parameters, chemical reactions can occur on the target surface, in-flight, or on the substrate, providing experts with precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin Film Deposition: Transfers material from the target to substrates, such as silicon wafers, to form uniform thin films.
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Semiconductor Etching: Used when high etching anisotropy is needed, with minimal concern for selectivity.
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Analytical Techniques: In secondary ion mass spectrometry (SIMS), sputtering allows measurement of target composition and detection of trace impurities.
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Space Applications: Contributes to space weathering, modifying the physical and chemical properties of airless celestial bodies like asteroids and the Moon.
