Bismuth (Bi) Sputtering Targets
Purity: 99.999% Size: 2” Thickness: 0.125”
Sputtering is a reliable technique for depositing thin films from diverse materials onto substrates of various shapes and sizes. The process allows chemical reactions on the target surface, in-flight, or on the substrate depending on the parameters, giving experts precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin Film Deposition: Transfers material from a target onto substrates such as silicon wafers.
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Semiconductor Etching: Provides high etching anisotropy when selectivity is not critical.
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Material Analysis: Supports techniques like Secondary Ion Mass Spectroscopy (SIMS) for composition analysis and trace impurity detection.
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Space Applications: Contributes to space weathering, affecting the physical and chemical properties of airless bodies like asteroids and the Moon.
About Bismuth (Bi)
Bismuth is a brittle, silvery-pink metal, stable in air and water. Despite its low thermal and electrical conductivity, it is widely used in:
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Fusible Alloys & Thermal Fuses: Low-melting materials suitable for solders and thermal fuses.
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Radiation Shielding: High gamma-ray absorption for filters or windows while allowing neutrons to pass.
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Thermoelectric & Magnetoresistive Devices: Enables thermoelectric conversion, large magneto-resistance devices, and reference electrodes for heavy metal detection.
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Thin Film Semiconductors: Bi films transform into semiconductors at a critical thickness of ~30 nm. Films can be deposited via DC/RF sputtering, pulsed laser deposition, or thermal evaporation.
Deposition parameters—including substrate temperature, target potential, ion beam energy, and energy release rate—affect the crystalline structure and morphology of Bi coatings. Positive pulses during DC sputtering improve film density and mechanical properties.
