Bismuth (Bi) Sputtering Targets
Purity: 99.999% Size: 1” Thickness: 0.250”
Sputtering is a reliable method for depositing thin films from various materials onto substrates of different shapes and sizes. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, allowing precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin Film Deposition: Transfers material from the target to substrates such as silicon wafers.
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Semiconductor Etching: Provides highly anisotropic etching when selectivity is not critical.
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Material Analysis: Supports techniques like Secondary Ion Mass Spectroscopy (SIMS) to determine composition and detect trace impurities.
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Space Applications: Contributes to space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
About Bismuth (Bi)
Bismuth is a brittle, silvery-pink metal that is stable in air and water. While it has low thermal and electrical conductivity, it is widely used in:
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Fusible Alloys & Thermal Fuses: Low-melting materials suitable for solders and thermal fuses.
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Radiation Shielding: High gamma-ray absorption for filters or windows while allowing neutrons to pass.
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Thermoelectric & Magnetoresistive Devices: Enables thermoelectric conversion, large magneto-resistance devices, and reference electrodes for heavy metal detection.
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Thin Film Semiconductors: Bi films transform into semiconductors at ~30 nm thickness, which can be deposited by DC/RF sputtering, pulsed laser deposition, or thermal evaporation.
Deposition parameters such as substrate temperature, target potential, ion beam energy, and energy release rate affect the crystalline structure and morphology of Bi coatings. Applying positive pulses during DC sputtering enhances film density and mechanical properties.
