Barium Titanate (BaTiO₃) Sputtering Targets
Purity: 99.99% Size: 4” Thickness: 0.125”
Barium Titanate (BaTiO₃) sputtering targets are high-purity ceramic materials designed for precision thin-film deposition. Sputtering technology enables controlled transfer of material from the target to a wide range of substrate shapes and sizes. The process is highly repeatable and scalable, supporting both small research applications and medium-to-large production batches. Depending on process parameters, chemical reactions may occur on the target surface, during particle transport, or directly on the substrate, giving engineers extensive control over film structure and quality.
Applications of Sputtering Targets
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Thin Film Deposition: Sputtering erodes material from the target and deposits it uniformly onto substrates such as silicon wafers.
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Semiconductor Etching: Used when a high degree of anisotropy is required and selectivity is less critical.
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Analytical Techniques: Employed in secondary ion mass spectrometry (SIMS) for composition analysis and detection of trace impurities as the target is sputtered at a constant rate.
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Space Research: Helps simulate space weathering effects on airless bodies like asteroids and the Moon.
Material Properties of BaTiO₃
Barium Titanate (BaTiO₃) is an inorganic compound that appears white as a powder and becomes transparent when formed into large crystals. It is a ferroelectric ceramic exhibiting piezoelectric and photorefractive properties, making it suitable for advanced electronic applications.
Common Uses
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Electronic ceramic components
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Capacitors
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Sensors
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Detectors
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Assemblies requiring ferroelectric or piezoelectric thin-film layers.
