Barium Titanate (BaTiO₃) Sputtering Targets
Purity: 99.99% Size: 3” Thickness: 0.250”
Barium Titanate (BaTiO₃) sputtering targets are high-purity ceramic materials used for precision thin-film deposition. Sputtering technology enables consistent transfer of material from the target to substrates of various shapes and sizes. The process is highly repeatable and scalable—from small R&D projects to medium and large-scale production. Chemical reactions may occur on the target surface, in transit, or directly on the substrate, depending on process parameters. These variables make sputtering a complex process but also allow experts significant control over film growth and microstructure.
Applications of Sputtering Targets
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Thin Film Deposition: Material is eroded from the target and deposited uniformly onto substrates such as silicon wafers.
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Semiconductor Etching: Used when high anisotropy is required and selectivity is not the primary concern.
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Analytical Techniques (SIMS): During secondary ion mass spectrometry, sputtering reveals composition and trace impurities by removing material at a controlled rate.
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Space Research: Sputtering simulates natural space weathering processes that alter surfaces of airless bodies like asteroids and the Moon.
Material Properties of BaTiO₃
Barium Titanate is an inorganic compound (BaTiO₃), white in powder form and transparent as large crystals. It is a ferroelectric ceramic material with strong piezoelectric and photorefractive properties, making it highly valuable in electronic and optical applications.
Common Uses
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Electronic ceramic components
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Capacitors
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Sensors
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Detectors
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Ferroelectric and piezoelectric thin-film assemblies.
