Barium Fluoride (BaF₂) Sputtering Targets
Purity: 99.99% | Size: 8” | Thickness: 0.250”
Sputtering is a proven technology for depositing thin films onto a wide variety of materials and substrate shapes. The process using sputter targets is repeatable and scalable, from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters. While sputter deposition is complex, it provides experts with precise control over film growth and microstructure.
Applications of Sputtering Targets:
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Thin-film deposition, transferring material from a “target” onto a “substrate,” such as a silicon wafer.
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Semiconductor etching, particularly when high anisotropy is needed and selectivity is not critical.
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Analytical applications, including secondary ion spectroscopy (SIMS), where sputtering allows precise measurement of material composition and detection of trace impurities.
Sputtering targets are also relevant in space applications. Sputtering contributes to space weathering, which alters the physical and chemical properties of airless bodies like asteroids and the Moon.
Barium fluoride (BaF₂) is a chemical compound of barium and fluorine, appearing as a solid that can form transparent crystals. It is particularly useful in the 10–20 µm infrared wavelength range. Industrial applications include aluminum metallurgy, enamel and glazing frit production, and welding agent preparation. In aluminum refining, BaF₂ acts as an additive to enhance the polishing process, enabling bright reflective surfaces. In flux brazing of aluminum and its alloys, inorganic fluorides such as BaF₂ are critical for removing oxide layers and ensuring high-quality surface treatment.
