Barium Fluoride (BaF₂) Sputtering Targets
Purity: 99.99% | Size: 5” | Thickness: 0.125”
Sputtering is a reliable method for depositing thin films onto a wide variety of materials and substrate shapes. Using sputter targets, the process is repeatable and scalable, from small R&D projects to medium- and large-scale production. Reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters, giving experts precise control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates such as silicon wafers.
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Semiconductor etching when high anisotropy is required.
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Material analysis, e.g., secondary ion spectroscopy (SIMS), detecting trace impurities.
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Space research: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium Fluoride (BaF₂):
BaF₂ is a transparent crystalline compound effective in the 10–20 µm infrared range. It is widely used in aluminum metallurgy, enamel and glazing frits production, and welding agents. In aluminum refining, BaF₂ aids chemical polishing to achieve bright reflective surfaces and plays a critical role in flux brazing of aluminum alloys by removing oxide layers.
