Barium Fluoride (BaF₂) Sputtering Targets
Purity: 99.99% | Size: 4” | Thickness: 0.250”
Sputtering is a reliable technology for depositing thin films on a wide range of materials and substrate shapes. The process using sputter targets is repeatable and scalable, from small R&D projects to medium- and large-scale production. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate, giving precise control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates such as silicon wafers.
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Semiconductor etching when high anisotropy is required.
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Material analysis, including secondary ion spectroscopy (SIMS) for detecting trace impurities.
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Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium Fluoride (BaF₂):
BaF₂ is a transparent crystalline compound effective in the 10–20 µm infrared range. It is widely used in aluminum metallurgy, enamel and glazing frits production, and welding agents. In aluminum refining, BaF₂ aids chemical polishing to achieve bright reflective surfaces and plays a crucial role in flux brazing of aluminum alloys by removing oxide layers.
