Barium Fluoride (BaF₂) Sputtering Targets
Purity: 99.99% | Size: 3” | Thickness: 0.250”
Sputtering is a reliable method for depositing thin films on a wide range of materials and substrate shapes. The process with sputter targets is repeatable and scalable—from small research projects to medium- and large-scale production. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on the process parameters, allowing precise control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates such as silicon wafers.
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Semiconductor etching, especially when high anisotropy is required.
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Material analysis, including secondary ion spectroscopy (SIMS) for detecting even trace impurities.
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Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium Fluoride (BaF₂):
BaF₂ is a transparent crystalline compound effective in the 10–20 µm infrared range. It is widely used in aluminum metallurgy, enamel and glazing frit production, and welding agents. In aluminum refining, BaF₂ acts as an additive to achieve bright reflective surfaces through chemical polishing. It is also essential in flux brazing of aluminum alloys by removing oxide layers.
