Barium Fluoride (BaF₂) Sputtering Targets
Purity: 99.99% | Size: 3” | Thickness: 0.125”
Sputtering is a reliable technique for depositing thin films on various materials and substrate shapes. This sputtering target offers repeatable performance and scalability, from small research projects to medium- and large-scale production. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, providing precise control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates such as silicon wafers.
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Semiconductor etching where high anisotropy is needed.
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Material analysis, including SIMS, for detecting even trace impurities.
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Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium Fluoride (BaF₂):
BaF₂ is a transparent crystalline compound, effective in the 10–20 µm infrared range. It is widely used in aluminum metallurgy, enamel and glazing frit production, and welding agents. In aluminum refining, it acts as an additive to achieve bright reflective surfaces through chemical polishing. It is also crucial in flux brazing of aluminum alloys by removing oxide layers.
